IB-19520CCP CROSS SECTION POLISHER™

Features of IB-19520CCP

• Cooling effect

  Specimen: Galvanized iron steel

  
  Normal milling (without cooling)
  Accelerating voltage 4kV

  
  Cooled milling (holder temperature -120°C)
  Accelerating voltage 4kV

  * For the Normal milling (without cooling), there are visible voids at the boundary between the iron and zinc, which are not seen in the cooled.

• Using the temperature control mechanism (option) for cooling

  Specimen: Si wafer bonding surface

  
  Normal milling
  (without cooling)

  
  Cooling
  (holder temperature -150°C)
  Accelerating voltage 6kV

  
  Cooling temperature control
  (holder temperature -20°C)
  Accelerating voltage 6kV

  * For the Normal milling (without cooling), the bonding agent is deformed by heat damage, and large voids appear. At -150℃, the cooling is excessive, and voids can be seen at the boundary of the bond and the dull side of Si wafer.
  There are no voids in the sample prepared with cooling temperature control.

• Intermittent process, Cooling and Cooling with temperature control functions handle a variety of work pieces

  

• Process monitor function

  The status of the cross-section milling can be monitored in real-time with the CCD camera.
  And the magnification can be varied.
  

• Anti-static coating function

  An optional ion beam sputter function is available.
  Create thin coatings with good granularity.
  Ideal for cases requiring pattern recognition, like EBSD.

• Planar ion milling holder

  The ion beam is irradiated at a low angle relative to the sample, allowing contamination on the surface layer to be removed, as well as smoothing of the surface.
  It is also ideal for selective etching.

• Cross Section Preparation kit

  This is a kit for performing ion beam milling while rotating the sample.
  This kit is used with the Planar ion milling holder.　
  Makes it possible to create cross-sections of samples prone to streaking when milled, such as porous materials, powders and fibers.
  

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