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Employing analyzers with variable energy resolution has made it possible to perform chemical bonding state analysis in a high-resolution mode, as well as high-speed mapping in a high-sensitivity mode.
Schottky Field Emission Electron Gun
An electron gun that achieves both image observation with 3nm spatial resolution, as well as high-throughput chemical bonding state analysis as a result of the large electric current of up to 200nA. This is possible by incorporating the electron optics technology that JEOL has developed over many years with the Schottky Field Emission Electron Guns employed in SEMs and EMPAs.
Eucentric Specimen Stage
The adoption of an eucentric stage, a necessity for an analysis device with multiple optics systems, provides highly accurate height center reproducibility. Freely-selectable tilting up to 90°makes difficult analysis of insulators possible.
Based on a long-life design concept, the running costs associated with the replacement of the ion gun filament and electron gun emitter have been reduced.
SoftwareSeparation of overlapped Auger peaks, which aggravate analysts, as well as complicated chemical bonding state analysis can be performed with one click using the waveform separation function.
Map restructuring software enables a wide range of analyses, such as re-setting of P/B after measurement, and tracking the changes over time during integration.
|Electron illumination system|
|SEI resolution||3nm（at 25kV, 10pA）|
|Probe diameter for Auger analysis||8nm（at 25kV, 1nA）|
|Electron gun||Schottky field emission gun|
|Accelerating voltage||0.5 to 30kV|
|Probe current||10-11 to 2×10-7A|
|Magnification||x 25 to 500,000|
|Auger analysis system|
|Analyzer||Electrostatic hemispherical analyzer (HSA)|
|Energy resolution（ΔE/E）||0.05 to 0.6%|
|Sensitivity||840,000 cps/7 ch or more
(at 10 kV 10 nA Cu-LMN, 0.6% resolution, 60tilt)
|Detection system||Multi-channel detection|
|Ion energy||0.01 to 4keV|
|Ion current (absorbed current)||2 A or more at 3,000 eV, 0.03A or more at 10 eV|
|Specimen movement||X: ±10 mm, Y: ±10 mm, Z: ±6 mm,
T (tilt): 0 to 90, R (rotation): 360(endless)
|Specimen size||20 mm in diameter (5 mm thick)|
|UHV evacuation system|
|Ultimate pressure in specimen chamber||5×10-8Pa or less|
|Baking out||Built-in heater, automatic baking out|
SEI (secondary electron image)
Wide area image analysis (optional),
Scheduling analysis (optional)
|Data processing||Qualitative analysis,
Peak deconvolution software (optional)
ExpandabilityAdditional ports to accommodate the following attachments are pro-vided, supporting a variety of analyses.
- Specimen Parking Unit
- Specimen Cooling and Fracturing Device
- Backscattered Electron Detector
- Energy Dispersive X-ray Spectrometer (EDS)
- Electron Backscatter Difraction Unit (EBSD)
- Transfer Vessel