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Advances in the development of new materials featuring complex nanostructures places increased demands on FIB-SEM instruments for exceptional resolution, accuracy and throughput. In response, JEOL has developed the JIB-4700F Multi Beam System to be used in morphological observations, elemental and crystallographic analyses of a variety of specimens.
The JIB-4700F features a hybrid conical objective lens, GENTLEBEAM™ (GB) mode and an in-lens detector system to deliver a guaranteed resolution of 1.6nm at a low accelerating voltage of 1 kV. Using an "in-lens Schottky-emission electron gun" that produces an electron beam with a maximum probe-current of 300nA, this newly-developed instrument allows for high-resolution observations and fast analyses. For the FIB column, a high-current density Ga ion beam of up to 90nA maximum probe-current is employed for fast ion milling and processing of specimens.
Concurrent with high-speed cross-section processing by FIB, high-resolution SEM observations and fast analyses can be conducted utilizing energy dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD). Additionally, a three-dimensional analysis function that automatically captures SEM images at certain intervals in cross-section processing is provided as one of the JIB-4700F's standard features.
High resolution SEM observation
Guaranteed resolution of 1.6 nm at a low accelerating voltage of 1 kV is delivered by a magnetic/electrostatic hybrid conical objective lens, GB mode and in-lens detector.
Fast analysis is enabled because high resolution can be maintained in analyses under large probe-current by the combination with an in-lens Schottky-emission electron gun and aperture angle control lens.
High speed processing
High-power Ga ion beam column enables rapid processing of specimens.
Enhanced detection system
Simultaneous detection system involving the newly-developed in-lens detectors allows for real-time observation of images from up to 4 detectors.
The JIB-4700F is compatible with a variety of optional attachments including EDS, EBSD, cryo-transfer systems, cooling stages and air-isolated transfer systems, etc.
Three-dimensional visualization of images and analysis data is possible with the combination with high-resolution SEM and appropriate optional analysis unit(s).
Stage linkage function
With the atmosphere pick-up system (optional) and stage linkage function, TEM (transmission electron microscope) specimens can be retracted with ease.
Picture overlay system
Overlaying an optical microscope image from the atmosphere pick-up system on FIB images makes it easier to identify a FIB processing point.
|Accelerating voltage||0.1 to 30.0kV|
|Image resolution (at optimum WD)||1.2nm (15kV, GB mode)
1.6nm (1kV, GB mode)
|Magnification||x20 to 1,000,000
(LDF mode available)
|Probe current||1pA to 300nA|
|Detector (*option)||LED, UED, USD*, BED*, TED*, EDS*|
|Specimen stage||Computerized 6-axis goniometer stage
X: 50mm, Y: 50mm, Z: 1.5 to 40mm, R: 360°, T: -5 to 70°,
FZ: -3.0 to +3.0mm
|Accelerating voltage||1 to 30kV|
|Image resolution||4.0nm (30kV)|
|Magnification||x50 to 1,000,000
(x50 to 90 obtained at 15kV or less)
|Probe current||1 pA to 90 nA, 13 steps|
|Processing shapes by milling||rectangle, line, spot, circle, bitmap|