- MultiBeam System (FIB)
- IB-07080ATLPS, IB-77080ATLPS Automatic TEM Specimen Preparation System STEMPLING
IB-07080ATLPS, IB-77080ATLPS Automatic TEM Specimen Preparation System STEMPLING
- Related Products
Automatic TEM Specimen Preparation System STEMPLING is software for automatic TEM specimen preparation by using FIB. This system was developed to satisfy the needs for specimen preparation using FIB, such as easy operation that is possible to anyone, and for the technology enabling creation of a large number of specimens. Owing to STEMPLING, high expert skills are not needed for specimen preparation, enabling anyone to easily prepare specimens. Also, since the system allows for unattended preparation of multiple specimens, work efficiency can be optimized via overnight operation to create a large number of specimens.
STEMPLING can be used with the Multi Beam System JIB-4700F and the Focused Ion Beam Milling & Imaging System JIB-4000PLUS.
Various specimens can be prepared with an easy setting
Standard recipes are provided to prepare 5 kinds of specimens such as a TEM specimen and a cross-sectional specimen.
It can be utilized in various scenes of specimen preparation using FIB.
Fig.1 Specimens that can be prepared using standard recipes. Specimen: Silicon wafer
Multiple specimens can be prepared by automatic processing
The ion beam auto adjustment function enables automatic preparation of multiple specimens over a long period of time.
This realizes unattended specimen preparation overnight. Fig. 2 shows the result of a continuous TEM specimen preparation for about 8 hours.
10 specimens were prepared, all of them were prepared in the same way, indicating that the automated specimen preparation was stable.
Thin film thickness: 100nm
Fig. 2 Example of a long-time continuous TEM specimen preparation (8 hours) Specimen: Silicon wafer
Reliable TEM specimen preparation of non-flat specimens
With an automatic eucentric adjustment, it is possible to automatically prepare specimens stably, even from materials that have uneven surfaces or different heights.
Fig. 3 shows the thin film specimen prepared by using an uneven surface specimen that has a step of about 70µm.
The thin film specimens were made correctly at the upper part and the lower part of the step.
Fig. 3 Example of preparation of TEM specimen with various surface heights
(Specimen:TEM specimen grid (Cu) on Si wafer)
|Product Name||Model||Applicable Instrument|
|Automatic TEM Specimen Preparation System||IB-07080ATLPS||JIB-4000PLUS|