Semiconductor and Electronic Parts
In the semiconductors field, JEOL Electron Beam Lithography Systems, SEMs, FIB (SEM)s, and TEMs are utilized in the processes of pattern generation, monitoring, defect analysis and packaging. Also for various electronic parts, our SEMs, FIB (SEM)s and TEMs are used.
PRODUCT LINEUP
APPLICATIONS NOTES
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Sensitivity enhancement of half-integer quadrupolar nuclei: DFS and RAPT
NM120014E
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Sensitivity enhancement in 29Si solid-state NMR by CPMG; Application to 29Si-1 HETCOR and 29Si DQMAS
NM120013E
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Resolution enhancement of 1H NMR by faster MAS and higher B0 field
NM120011E
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Quick measurements of 15N solid-state NMR at natural abundance by high-sensitivity 8 mm MAS
NM120010E
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Auger Analysis of CP Cross Section
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Extremely High Sensitivity Cryogenic Probe, UltraCOOL Probe
NM120007E
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Homonuclear covariance transformation in solid-state NMR!
NM120006E
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New ESR Spectrometer JES-X3 series
ER120003E
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110 kHz MAS solid-state NMR
NM120001E
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Argon Beam Cross Sectioning
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An Appraisal of High Resolution Scanning Electron Microscopy Applied To Porous Materials
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Artifact-free cross-sections
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Precise SEM Cross Section Polishing via Argon Beam Milling
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Preparation of a High Quality Cross Section of a Bone Tissue for SEM
-Application of the Cross-section Polisher to a Biological Specimen-
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Wide Area Auger Mapping
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Auger Image Collection from Defined Areas
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Auger Microprobe JAMP-9500F
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Chemical Status Analysis using AES
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AES Neutralizing Gun (FMIED)
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Combining UHV-SEM and EBSD
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Specimen Preparation Devices for JAMP-7800 Series
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Auger Analysis Scheduling Program
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Auger Analysis of CP Cross Section
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Study of Nanoparticles at UTSA: One Year of Using the First JEM-ARM200F Installed in USA
JEOLnews Volume 46, Number 1,2011
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Exploring Biological Samples in 3D Beyond Classic Electron Tomography
JEOLnews Volume 46, Number 1,2011