化学研磨

chemical polishing

[目次：試料等(試料および試料作製)]

半導体や絶縁体の無機化合物の試料作製に使われる方法。強酸や強アルカリを基本にした研磨液に試料を浸して試料表面を平滑に保ちながら薄膜化する。機械的なひずみを与えずに試料作製ができるのが利点。通常、選択的な溶解(エッチング)が起きないような研磨液が使われる。半導体多層膜の特定の層を観察するときには、その層を残してほかの層を溶かすような溶液が使われる。

"Chemical polishing" is a technique used for thinning inorganic materials of semiconductors and insulators. In this technique, a specimen is immersed in a polishing solution that is mainly composed of strong acid or strong alkali. Then, the specimen is thinned with its surface kept smooth. The advantage of chemical polishing is that thin specimens can be made with no mechanical distortion stress. Normally, a polishing solution that does not cause selective dissolution (etching) is used. When a particular layer in a multi-layer semiconductor is required to observe, a specified solution is used, which dissolves other layers while leaving the particular layer.

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